home  >  company  >  events  >  esec2009  >  index    Print pagePrint page E-mail pageE-mail page

Compañía

» Inicio

Eventos

» Inicio
» Archivo de Eventos

Events 2010

» EU partner conference
» Computex
» ESEC
» ESC SV
» embedded world
» Digital Signage Expo
» Lunch@Piero's / CES

Boletines VIA

» Suscríbase

May 13-15, 2009
Booth number 28-33, East Wing
Tokyo Big Sight, Japan (Tokyo International Exhibition Center)

Join VIA at ESEC Japan for a chance to see exciting x86 applications in compact, yet full-featured form factors! VIA will be showing a range of products, including components, boards and complete systems.

Visitors will be able to experience the first ever Pico-ITX-based digital signage solution, the new Pico-ITXe form factor with the SUMIT™ connectors as well as enjoy a first-hand look at VIA's latest Em-ITX form factor with dual I/O coastlines.

Take full advantage of your visit and learn more about how VIA can help you achieve your goals.

  • Learn about VIA's one-stop-shop service that provides a comprehensive product portfolio of VIA developed components, boards, systems, and accessories.
  • Learn about VIA's latest design and development services, providing an extensive product range that includes everything from embedded boards and chassis, to riser cards and customizable storage solutions.
  • Learn how VIA's new universal industrial chassis family — the AMOS series — can help you get on the fast track in developing complete ruggedized systems for a wide variety of applications in the embedded market.
  • Learn how the S3 4300E GPU can take your embedded system designs to the next level in the age of HD multimedia.

Other notable new VIA products on display include a rugged, yet compact system with fanless operation based on the Em-ITX form factor; the AMOS-3000, an ultra-compact fanless computer system based on the Pico-ITX form factor; the VIA VIPRO panel PC, perfect for any HMI interface with its thin, fanless, and IP65-compliant design; and other SoC products for special request service.

VIA is a complete x86 platform provider with the richest blend of ultra-low power processors, feature-rich chipsets, full complement of companion chips, and customer driven services. Giving you the best single-point-of-service, VIA guarantees platform compatibility, and aims to help you achieve your goals with the shortest product development time.

For more information about ESEC Japan, click here.


   Inicio  »  Información de marca  »  Sugerencias   »   Mapa del Sitio Copyright©2010 VIA Technologies, Inc.